![]() The chamber arrangement for a typical RIE process is shown as below: The electrode is powered by a 13.56 MHz RF generator. This system supports wafer sizes up to 6 inches, and provides PECVD film growth over a wide range of process conditions. Oxford Plasmalab 80 Plus Plasma Etcher is a plasma processing system, which can be configured to carry out reactive ion etching(RIE). ![]() The PECVD has a variable temperature stage (RT to 600 ☌). ![]() With the new year comes classes, programs and other events at the Cleburne Public Library, library assistant Amy Graham said. The Plasma-Enhanced Chemical Vapor Deposition (PECVD) system is an Oxford Instruments Plasma Technology Plasmalab System 100 platform that is optimized for amorphous silicon, silicon dioxide, and silicon nitride deposition. Library offers database, other classes, programs.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |